Thin is In

Shrinking process windows and a variety of new materials and processes associated with the transition to 90 and 65 nm technologies, as well as the stringent requirements and costs associated with 300-mm manufacturing, place new demands on thin film process control and necessitate the migration to increasing on-product metrology. This article reviews both recent advancements in spectroscopic ellipsometry, as well as new techniques that enable semiconductor manufacturers to meet the thin films process control challenges of 65 nm and beyond.



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