“All levels of the supply chain are currently trying to successfully implement a lead-free program,” says David Bergman, IPC’s vice president of standards, technology, and international relations. “Bringing the conference ‘home’ to North America will allow industry members here to learn more about hot issues concerning lead elimination and lead-free alternatives. With the compliance deadline rapidly approaching, information sharing is more critical than ever.”
(October 18, 2005) Colorado Springs, Colo. — IC Interconnect (ICI) has qualified its Ni/Au pad resurfacing process for high-temperature wire-bond applications, producing bonds that are stable at high temperatures with a thinner gold layer, particularly useful in avionics and automotive applications. This new process eliminates Kirkendall voiding that occurs in an Al/Au interface at 200°C thermal exposures.