IMEC, TEL prep EUV, immersion lineup

December 8, 2005 – European R&D consortium IMEC is installing two 300mm coater/developer tools from Tokyo Electron Ltd. for use in EUV and 193nm immersion lithography work. The EUV work, part of IMEC’s Industrial Affiliation Program on EUV lithography and an extension of an existing IMEC-TEL partnership, will begin in January and run for three years. A TEL 193nm Clean Track Lithius i+ immersion system, based on earlier work with an installed TEL track tool, will be installed in 1Q06 and interfaced with ASML’s XT:1700i scanner slated for delivery early next year.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...