ASML, SEMATECH qualifying RET for sub-45nm designs

September 19, 2006 – SEMATECH and its manufacturing-oriented subsidiary, the International SEMATECH Manufacturing Initiative (ISMI), have signed an agreement to incorporate ASML Holding NV’s resolution enhancement techniques (RET) in order to qualify imaging performance of advanced logic patterns, metrology structures, and defect designs for the 45nm, 32nm, and 22nm technology nodes.

Under the deal, ASML will supply advanced RET mask patterns for the SEMATECH design structures and deliver a fully qualified set of masks together with a set of validation wafers. ASML will also develop optimized scanner settings for the mask patterns to be exposed on the company’s TWINSCAN XT:1700i scanner, at ASML’s demo lab facility in Veldhoven, The Netherlands, measuring the imaging performance of the exposures through SEM measurements and simulations.

“We are pleased to collaborate with ASML on determining the right lithography solutions for the 45nm, 32nm, and 22nm technology nodes,” stated John Allgair, litho metrology program manager for ISMI. “We are looking forward to reviewing the results from this project and making some key technology selection information available to our member companies.”

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