Sep. 19, 2006 — Synova, a developer of water jet-guided laser technology, announced it has received a follow-on order from Vishay Intertechnology, one of the world’s largest manufacturers of discrete semiconductors and passive components, for its Laser Dicing System (LDS) 200.
Synova says that the LDS 200 demonstrated significant performance advantages, precision dicing capabilities and ROI benefits over conventional dry lasers and diamond-saw blades — all of which were factors in this most recent purchasing decision. The LDS 200 is slated for installation in January 2007 at the chipmaker’s Taiwan-based facility.
In a related announcement, Synova reports that it is teaming with Trend Laser Technology — its distribution partner in Taiwan since 2004 — to establish the latest in its string of regional micromachining centers (MMCs). Leveraging Trend Laser’s state-of-the-art facility in Taipei, the new MMC will serve as a machine and process-demonstration and application development center for Taiwan-based semiconductor and electronics companies.
Featuring an application laboratory that will house Synova’s advanced Laser MicroJet tools, the MMC will provide customers with access to the company’s water jet-guided laser technology and expertise. The new facility is expected to be fully operational by the first quarter of 2007.