(January 24, 2007) LYON, France and PITTSBURGH — The future of MEMS and 3-D packages relies on similar factors — consumer drivers and increased integration — according to industry analysts. 3-D integration will affect MEMS and IC packaging industries, says report “3-D ICs,” authored by Eric Mounier, Ph.D., co-founder and market analyst for MEMS, optoelectronics, and new advanced packaging, Yole Développement. Yole (Lyon, France) predicts that 3-D integration will adapt techniques and knowledge originally designed for the MEMS industry to other markets, such as stacked memory and stacked memory/logic. Stacked packages, FPGAs, miniaturized ICs, and MEMS all require acceptance from the consumer market to reach targets for technological advancement, commercialization, and sector revenues.
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