(March 14, 2007) MUNICH, Germany and WESTFORD, MA — Zuken joined the advanced design, partitioning, and test for system-in-package electronics (ADEPT-SiP) project, a collaboration between industry partners, academia, and the U.K. government, to develop a design and manufacturing methodology for system-in-package (SiP) technology. The program operates as part of the Department of Trade and Industry (DTI).
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