SMT/Hybrid/Packaging Highlights

The VDI/VDE-IT production line showcases multifunctional packaging, a trend in electronic-module manufacturing. In Hall 7, this line and supporting demonstration islands is hosted by VDI/VDE and industry. In the “Optic Meets Electronic” station, Fraunhofer IZM and other companies demonstrate optoelectronic packages, modules, and assemblies; optical interface technologies and materials; production technologies; and other products.

(April 25, 2007) SAN JOSE, CA &#151 Gerald K. “Skip” Fehr, Ph.D., joined Mirror Semiconductor’s technical advisory board (TAB), to develop the company’s wire-bonding designs, named Mirrored Pinout. Fehr, an industry consultant in San Jose, has served at Fairchild Semiconductor, Intel, LSI Logic, and Texas Instruments (TI).


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