May 2, 2007 — SUSS MicroTec has introduced the DSM200, an automated metrology system for double-sided (front-to-back) alignment and exposure applications.
The cassette-cassette system enables verification of alignment accuracy on wafers from 2 inches to 200mm. Incorporating new pattern-recognition technology, it promises measurement accuracy of 0.2 microns at 3 sigma with minimial operator intervention.
Based on SUSS’s MA200Compact Mask Aligner, the DSM200 targets the manufacture of MEMS devices, power semiconductors, and optoelectronics.
|SUSS’s DSM200 double-sided metrology system. (Photo: Business Wire)|