(June 18, 2007) TAIPEI, Taiwan — Suppliers of graphics chips, mobile phone components, LCD driver ICs, and memory modules are driving business growth at packaging houses in Taiwan, according to the China Economic News Service (CENS). Capacity utilization at Taiwan-based SATS providers is reported to be in the 90% range, up from forecasts of 8090% utilization made earlier in 2007. CENS suggests that the increase in packaging capacity will create an increase in demand for substrates and contact probes at Taiwan-based assemblers.
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