June 28, 2007 — InvenSense Inc., provider of integrated motion sensing solutions for mobile consumer electronics, says its patented MEMS fabrication technology, called Nasiri-Fabrication has enabled the company to bring low-cost, low-power, integrated gyroscopes to market for a range of mobile consumer products including digital cameras, camera phones, and 3D input devices.
According to the company, Nasiri-Fabrication is the world’s first MEMS fabrication platform to use a patented wafer-to-wafer bonding process that directly integrates pre-fabricated MEMS wafers to off-the-shelf CMOS wafers at the wafer level.The process simultaneously provides hermetic sealing of all critical MEMS elements at wafer level. “Our fabrication platform addresses the most critical aspects of any MEMS-based product, mainly the cost of packaging and testing, which has traditionally been greater than 80 percent of the total cost of the product,” said Ram Krishnan, Vice President of Operations for InvenSense.
“In a very short time, InvenSense has accomplished both technology and product development successes that other MEMS leaders have not achieved with many years of research and development effort,” said Jean-Christophe Eloy, general manager of YOLE Development, the French-based market research and strategy consulting company focused on MEMS and disruptive semiconductor technologies. “This re-invention of the way MEMS devices are manufactured and packaged, for the dual-axis gyro motion sensing market as an example, is a great validation of the impact the Nasiri-Fabrication process will have on the MEMS business overall.”
“Fabless MEMS companies are at a major disadvantage compared to their fabless semiconductor counter parts, in large part due to a lack of any available MEMS fabrication solution that can meet their cost and high volume production needs,” said Steven Nasiri, CEO and Founder of InvenSense. “Nasiri-Fabrication is the reason we can bring our innovative dual-axis gyroscope products to the market in record time and at much lower price points, which will continue to drive our future innovation in MEMS product development.”