Amkor, IMEC collaborate on 3D wafer-level packaging

July 19, 2007 — Amkor Technology, Inc., provider of advanced semiconductor assembly and test services, and IMEC, the Belgium-based independent nanoelectronics and nanotechnology research center, have announced a 2-year collaboration agreement to develop cost-effective, 3D integration technology based on wafer-level processing techniques.

“This collaboration with IMEC will enhance our continuing efforts to develop low cost, state of the art packaging solutions for our customers”, said Dan Mis, Amkor’s Senior Vice President for Wafer Level Advanced Product Development.

Luc Van den hove, IMEC’s Executive Vice President and COO, commented: “We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level.”

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