Hynix upgrades MCP to 24 stacked chips

September 5, 2007 – Hynix Semiconductor reportedly has developed a multichip package with 24 stacked NAND flash memory chips, improving on its existing design, according to the Korea Times.

This spring, Hynix showed off the capability to stack 20 chips (thinned to 25µm) in a 1.4mm thick package, using tilting steps to be less susceptible to malfunctions.

The new technology, also just 1.4mm thick, incorporates 25 stacked NAND flash chips, enabling 16GB NAND flash with up to 384Gb of storage in a single device. The paper cited an unnamed Hynix official vaguely projecting a new version with 28 stacked chips “in coming years,” but without any hint of a timeline.

PHOTO CAPTION: Hynix’s multi-chip package with 24 stacked NAND flash memory chips. (Source: Korea Times)

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