The Latest in LED Packaging

Philips Lumileds’ LUXEON K2 has thin film flip chip (TFFC) technology that contributes to overall light output improvement, excellent optical performance and improved thermal capability. New packaging advancements deliver a low thermal resistance 5.5° C/W. Light output performance from a LUXEON K2 with TFFC part binned and tested for 160 lumens minimum and 1A drive current can easily exceed 220 lumens at higher drive currents.

(November 16, 2007) SAN JOSE, CA — North American-based manufacturers of semiconductor equipment posted US$1.23B in orders in October 2007 (three-month average basis) and a book-to-bill ratio of 0.83, according to the October 2007 Book-to-Bill Report published by SEMI. A book-to-bill of 0.83 means that $83 worth of orders were received for every $100 of product billed for the month.

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