SEMI publishes eight new technical standards

February 11, 2008 — /PRNewswire/ — SAN JOSESEMI, CA — SEMI has published eight new technical standards applicable to the semiconductor, flat panel display, and MEMS manufacturing industries. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers, and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format, or can be downloaded from the SEMI website (www.semi.org).

SEMI standards are published three times a year. The new standards, part of the March 2008 publication cycle, join more than 770 standards that have been published by SEMI during the past 34 years.

“These SEMI standards represent new ground the volunteers in the SEMI International Standards Program have broken over the years, including two new standards applicable to FPD manufacturing,” says Bettina Weiss, SEMI director of international standards. “As the FPD industry grows and technical requirements are defined earlier and in concert with suppliers and panel makers, these new specifications provide critical solutions to manufacturing challenges.”

The standards released today include a test method for determining the leak integrity of gas delivery systems; a guide for design and materials for interfacing MEMS microfluidic systems; and environmental, health, and safety guidelines for FPD manufacturing.

The full list of SEMI standards released includes:

  • SEMI C64: SEMI statistical guidelines for ship to control
  • SEMI C65: Guideline for trimethylsilane (3MS), 99.995% quality
  • SEMI C66: Guidelines for trimethylaluminium (TMAl), 99.5% quality
  • SEMI D51:Specification for handshake method of single substrate for handing off/on tool in FPD production
  • SEMI F106: Test method for determination of leak integrity of gas delivery systems by helium leak detector
  • SEMI M72: (Preliminary)
    test method for determining wafer flatness using the moving average qualification metric based on scanning lithography
  • SEMI MS6: Guide for design and materials for interfacing microfluidic systems
  • SEMI S26: Environmental, health, and safety guideline for FPD manufacturing system

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays, photovoltaic systems, and micro-electromechanical systems (MEMS). About 1,650 volunteers worldwide participate in the program, which is made up of 18 global technical committees.

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display, and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster, and more economical products that improve lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets, and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.

Visit www.semi.org

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SEMI Publishes Eight New Technical Standards

(February 12, 2008) San Jose, CA — SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD), and MEMS manufacturing industries. One of the standards, the SEMI MS6, provides a guide for design and materials for interfacing MEMS microfluidic systems.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
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