Electrical Nanoprobing with DualBeam™ Systems

Electrical testing by physically probing device structures is more challenging with increasing circuit density and complexity. Nanoprobing with the aid of SEM or a FIB has been used for several years in advanced failure analysis labs to isolate and locate physical defects in circuit chips, both on wafers and in packaged devices. This white paper describes a new approach – a DualBeam™ SEM/FIB with an in-situ probe system.

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