Site-Specific 3D Characterization of Semiconductor Devices with DualBeam™ Systems

Faster, smaller semiconductor devices require higher resolution for the imaging and analytical techniques used to support manufacturing operations. As device structures become more complex, the simple top-down view provided by optical microscopes and SEMs is no longer sufficient. DualBeam™ systems have emerged as enablers of advanced manufacturing processes by making the third dimension accessible to a wide variety of metrology, process control and failure analysis techniques. This white paper discusses the critical role of DualBeam™ technology as the industry moves to 65 nm and below.

Format: RES
Size: 0.00


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...