Site-Specific 3D Characterization of Semiconductor Devices with DualBeam™ Systems

Faster, smaller semiconductor devices require higher resolution for the imaging and analytical techniques used to support manufacturing operations. As device structures become more complex, the simple top-down view provided by optical microscopes and SEMs is no longer sufficient. DualBeam™ systems have emerged as enablers of advanced manufacturing processes by making the third dimension accessible to a wide variety of metrology, process control and failure analysis techniques. This white paper discusses the critical role of DualBeam™ technology as the industry moves to 65 nm and below.



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