3D Integration Tour: Are TSVs the Future of Advanced Packaging?

By Julia Goldstein, contributing editor
(May 22, 2008) San Jose, CA &#151 The “3D Integration North American Tour” came to San Jose on May 15 after stops in Durham, NC and Dallas, TX. The event, hosted by SUSS MicroTec, Surface Technology Systems (STS) and NEXX Systems outlined the current state of the art in through silicon vias (TSVs) and related technology. An overview by consultant Phil Garrou, Ph.D. of MCNC describing various process steps involved in 3D TSV technology led naturally into detailed presentations on processes and materials.

(May 22, 2008) SINGAPORE &#151 STAT ChipPAC hosted its inaugural Supplier Day, honoring eleven materials and equipment suppliers for outstanding contribution as key suppliers. The awards ceremony, held on May 13 in Singapore, recognized supplier achievements in 3 categories: outstanding overall performance, outstanding service, and special site outstanding service.

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