In response to market needs for 300mm process equipment capabilities to demonstrate 3D processes, SUSS MicroTec has introduced The XBC300. The XBC300 is designed for 3D integration and 3D packaging with through silicon vias (TSVs) and is ideal for the CMOS image sensor (CIS) early adopter market.
The XBC300 is tailored to cover all 3D requirements by different process modules allowing for a combination of capabilities in a small package. The tool performs a range of wafer bonding processes in a small footprint. That, combined with high throughput capabilities reportedly optimizes cost of ownership for CIS applications. Process capabilities include 3D stacking with Cu-Cu that have smaller than 10um vias, fusion bonds including low-temperature processing for submicron overlay accuracy, force parallelism and uniformity ensures polymer confinement, and hybrid bonding of metal interconnects dielectrically isolated with either deposited oxide layers or adhesives. SUSS MicroTec, Wafer Bonder Division, www.suss.com