Dual-purpose 300mm dicing frame prober

The WDF 12DP is designed to address increased demand for probing ultrathin and diced wafers, and wafer-level testing of chip-scale and wafer-level packaging, stacked, and 3D technologies, as well as KGD testing of ultra-hin wafers, singulated wafers, and strips on a dicing frame. It uses on-axis alignment and N-shot alignment, offering “superior” accuracy and the ability to test in parallel. The system can also be used as a standard wafer prober. Tokyo Electron America, Austin, TX; www.ph.com.


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