A New Method of Wafer-Level Plan-View TEM Sample Preparation by DualBeam

Transmission electron microscopy (TEM) is extremely important for obtaining high-resolution images with high materials contrast. Until now, plan-view TEM samples could only be prepared by breaking the wafers in a laboratory environment. Read about a new plan-view TEM sample preparation methodology that works on the manufacturing line and keeps 300mm wafers intact. This innovative technique provides a quick turn-around for defect analysis, improving investigation of in-plane defects and analysis of shorts detected with voltage-contrast inspection.



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