EPCOS’s tiny sensor comes with MEMS packaging

February 20, 2009: EPCOS AG is introducing what the Munich-based company is calling the world’s most compact packaged sensors for barometric pressure measurement, and it comes with the firm’s chip-sized MEMS packaging.

With dimensions of only 1.7×1.7×0.9 mm2, the components are many times smaller than comparable competitor products and open up numerous applications for portable electronics, the company said in a news release.

A further advantage of the new sensors is the cost-effective CSMP (chip-sized MEMS package) packaging technology developed by EPCOS, the news release said.

EPCOS also offers a sensor variant in a conventional package with a gel-protected stainless steel pressure port. With a footprint of only 3×3 mm2 the ASB1200E SMD pressure sensor enables the further miniaturization of barometric applications that are exposed to high humidity, the company said.


Tiny barometric pressure sensors open up numerous portable electronics applications, EPCOS says. (Photo courtesy of EPCOS AG)

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