High Precision Ion Beam Milling with Time of Flight Compensation

Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility of advanced CE for small geometries. ToF compensation in the ion-column deflection system increases beam placement accuracy and consequently pattern accuracy by reducing dwell times to as short as 50 nanoseconds. The authors of this paper have validated this approach through machining and filling 50-nm vias. Read the paper to learn how FIB operators can drastically shorten dwell times and pixel rates to improve gas milling and deposition activities.

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