Next-gen bond tester software launch from Nordson DAGE

(September 7, 2010) — Nordson DAGE, a subsidiary of Nordson Corporation (NASDAQ: NDSN) and provider of bond testing technology, introduced Paragon intelligent bond testing software for semiconductor packaging. Paragon provides flexible analysis and high accuracy and repeatability of test data by monitoring of all aspects of the Nordson DAGE bondtester.

Highly intuitive with a configurable interface, Paragon software offers easily accessible test set-up parameters, a check list enabling a quick start; advanced features (including semi-automatic test routines), a unique database search engine wizard, and reporting. Data presentation is enhanced by extensive charting functionality, allowing several graphs to be displayed at once, also including the images from the camera systems with the results. 

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Paragon software monitors life tests on the Nordson DAGE bond test tool, load cartridge and calibration jig, and health checks. Automatic alerts can prevent downtime and Paragon includes advanced failure mode grading.

Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.

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