(November 8, 2010) — Advanced Packaging asked our readers where — at the foundry, in a dedicated semiconductor assembly and test services (SATS) house, or on the SMT line — package-on-package (POP) assembly should take place.
The majority vote goes to the packaging house (about 53% of votes), with respondents stating that the testing capability and experience gives SATS providers the edge. SATS companies offer full turnkey solutions providing not only packaging solutions, but also test services on individual units and on stacked packages, said one reader. Another noted that the packaging house provides the lowest-cost solution without impacting SMT assembly time or technology. Chip fab and SMT line both garnered approximately equal votes.
Still another respondant states, "If everything comes from a single chip fab that is equipped for PoP assembly, then the fab is suitable. Commonly, however, PoP is used to mix standard and custom silicon, or silicon from different product lines. In this case, either the package-assembly house or the SMT line may be appropriate, depending on the technologies. The SMT line has advantages if the resolutions and solder technologies are compatible with the line, which is not always the case; sometimes you also want POP to be pre-sealed. This will leave space for a separate packaging-assembly line — though this does not necessarily imply a dedicated packaging-assembly house."
You can still take the survey and let us know what you think, here: http://www.surveymonkey.com/s/packageonpackage