Dual axis MEMS gyroscope Wii gets reverse costing engineering analysis by Research and Markets

January 11, 2011 – BUSINESS WIRE — Research and Markets added the "Invensense IDG 600/650 MEMS gyro 2-axes Reverse Costing" report to their offering. The report offers reverse costing & engineering process analysis of the Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense and integrated in Wii motion accessory, including physical analysis, reconstruction of the process flow, and estimates on manufacturing and selling prices.

The IDG-600, integrated in the Nintendo Wii Motion Plus accessory and its standard variation IDG-650 share the same hardware. The components are manufactured using a three-bonded-wafer processs: a thin sensor wafer and a protective cap wafer processed with bulk micro machining and an ASIC wafer for signal conditioning.

The IDG-600/650 gyroscopes are suitable for high-performance motion-sensing game controllers, pointing devices, multimedia remotes, and computer mice applications.

This report provides complete teardown of the MEMS Gyroscope with:

  • Detailed photos
  • Material analysis 
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

The report includes a glossary and overview, as well as description of the reverse costing methodology. The InvenSense profile covers product range and business model.


  • Physical analysis
    Synthesis of the Physical Analysis
    Physical Analysis Methodology
    Package Characteristics & Markings
    Package Opening & Bonding Number
    IDG-600 / IDG-650 Comparison
    Device Structure
    Device Dimensions
    ASIC Markings
    ASIC Minimal Dimension and Metal Layers
    ASIC Main Blocks
    ASIC Process Characteristics
    MEMS Markings
    MEMS Sensor IR View
    MEMS Sensor Details
    Component Cross-Section
    MEMS process characteristics
  • Manufacturing Process Flow
    ASIC Process Flow (CMOS + Cavity Etch)
    MEMS Process Flow (Cap + Sensor + Assembly)Cost Analysis
  • Synthesis of the Cost Analysis
    Main Steps of Economic Analysis
    Supply Chain Analysis
    Manufacturers financial ratios
    Yields Explanation
    ASIC Front-End Cost
    MEMS Front-End Cost
    MEMS Front-End Cost per Process Steps
    MEMS Front-End : Equipment Cost per Family
    MEMS Front-End : Material Cost per Family
    Total Front-End Cost (ASIC + MEMS + Assembly)
    Back-End: Probe Test and Dicing
    Total Wafer Cost (Front-End + Back-End 0)
    Die cost
    Packaging Cost
    Final Test Cost
    Component Manufacturing Cost
    Yield Synthesis
    Estimated Manufacturer Price Analysis Conclusion

For more information visit http://www.researchandmarkets.com/research/596b56/invensense_idg_600

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...