CEA Leti adds SPTS on 3D IC line with 300mm PVD order

February 9, 2011 — SPP Process Technology Systems (SPTS), plasma etch, deposition, and thermal processing equipment manufacturer for the semiconductor industry, received a follow-on purchase order from CEA-Leti for its Sigma fxP physical vapor deposition (PVD) system. The 300mm system will be used for advanced through-silicon via (TSV) development at Leti’s new 300mm fab extension in Grenoble, France.

In October 2010, Leti and SPTS agreed to collaborate on creating next-generation high-aspect ratio TSVs. The new Sigma system will join SPTS’ silicon etch and dielectric deposition systems previously selected for this new line.
 
Leti’s integration line features a complete suite of the equipment required for research and development on advanced 3D IC single processes and integration. The Sigma fxP will deposit the diffusion barrier and seed metal layers prior to the final Cu electroplating via fill process. Using SPTS Advanced Hi-Fill (AHF) technology, ionized PVD deposition techniques will maximize metal coverage in the via, creating an environment for cost-effective via fill fin high aspect ratio architectures.
 
"We are working closely with SPTS on next-generation 3D IC developments, and their metal deposition capability forms an integral part of our development process," said Dr. Laurent Malier, CEO of CEA-Leti, adding that SPTS has integration expertise in all three areas of deep reactive ion-etching (DRIE), dielectric deposition, and metal seed deposition.

SPTS participated at Leti’s Inauguration Day activities in January, and presented on future TSV trends and technical requirements in advanced 3D-IC manufacturing.
 
The Sigma fxP system is a single-wafer cluster tool designed for high-volume PVD processing, offering excellent process control with high throughput. It is a flexible system supporting various process chamber configurations and combinations to address specific applications. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversions. Key applications for the Sigma fxP include very thick Al alloys for power device and next generation CMOS bondpads, ionized and conventional PVD for 3D-IC and wafer level packaging (WLP) as well as highly uniform aluminium nitride (AlN) for RF MEMS devices.

SPP Process Technology Systems was established in October 2009 as the vehicle for the merger of Surface Technology Systems and acquired assets of Aviza Technology. The company is a wholly-owned subsidiary of Sumitomo Precision Products Co., Ltd., and designs, manufactures, sells, and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. For more information on SPTS, visit www.spp-pts.com

CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. For more information, visit www.leti.fr.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...