Hermetic wafer level packaging lowers cost with IMT Au Au bond

March 8, 2011 – BUSINESS WIRE — IMT, wafer level packaging (WLP) company and MEMS foundry, introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding. In development for nearly a year, this bond is being actively used in production, and it is said to be one of the lowest cost methods of achieving a hermetic wafer level package bond.

Low-temperate, low-cost wafer bonding could benefit MEMS packaging, as well as other applications.

In addition to the Au-Au thermo compression and the other bond technologies supported, IMT’s flagship remains its proprietary low-temperature hermetic eutectic bond. With sealing temperatures below 190°C and support for reflow temperatures of more than 500°C, this bond is ideal for temperature-sensitive sensors or electronics that require a hermetic package. The bond line width is controlled at less than 50µm.

"More than 80% of our total business makes use of wafer level packaging," said John Foster, IMT Chairman and CEO.

IMT produces and develops MEMS devices and is a pure-play MEMS foundry in the United States. IMT designs, manufactures, tests and supplies products to the RF, biotech, biomed, optical communications, infrared, navigation and general markets servicing Fortune 500 companies as well as startups. For more information, visit http://www.imtmems.com.

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Hermetic wafer-level packaging lowers cost with IMT Au-Au bond

March 8, 2011 – BUSINESS WIRE — IMT, wafer level packaging (WLP) company and MEMS foundry, introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding. In development for nearly a year, this bond is being actively used in production, and it is said to be one of the lowest cost methods of achieving a hermetic wafer level package bond.

Low-temperate, low-cost wafer bonding could benefit MEMS packaging, as well as other applications.

In addition to the Au-Au thermo compression and the other bond technologies supported, IMT’s flagship remains its proprietary low-temperature hermetic eutectic bond. With sealing temperatures below 190°C and support for reflow temperatures of more than 500°C, this bond is ideal for temperature-sensitive sensors or electronics that require a hermetic package. The bond line width is controlled at less than 50µm.

"More than 80% of our total business makes use of wafer level packaging," said John Foster, IMT Chairman and CEO.

IMT produces and develops MEMS devices and is a pure-play MEMS foundry in the United States. IMT designs, manufactures, tests and supplies products to the RF, biotech, biomed, optical communications, infrared, navigation and general markets servicing Fortune 500 companies as well as startups. For more information, visit http://www.imtmems.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

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07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
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