March 8, 2011 – BUSINESS WIRE — IMT, wafer level packaging (WLP) company and MEMS foundry, introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding. In development for nearly a year, this bond is being actively used in production, and it is said to be one of the lowest cost methods of achieving a hermetic wafer level package bond.
Low-temperate, low-cost wafer bonding could benefit MEMS packaging, as well as other applications.
In addition to the Au-Au thermo compression and the other bond technologies supported, IMT’s flagship remains its proprietary low-temperature hermetic eutectic bond. With sealing temperatures below 190°C and support for reflow temperatures of more than 500°C, this bond is ideal for temperature-sensitive sensors or electronics that require a hermetic package. The bond line width is controlled at less than 50µm.
"More than 80% of our total business makes use of wafer level packaging," said John Foster, IMT Chairman and CEO.
IMT produces and develops MEMS devices and is a pure-play MEMS foundry in the United States. IMT designs, manufactures, tests and supplies products to the RF, biotech, biomed, optical communications, infrared, navigation and general markets servicing Fortune 500 companies as well as startups. For more information, visit http://www.imtmems.com.