April 19, 2011 – Marketwire — STATS ChipPAC Ltd. (SGX-ST: STATSChP), semiconductor test and advanced packaging service provider, is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities.
The TSV investment is the addition of a 300mm "mid-end" process flow that occurs between the wafer fabrication and back-end assembly process. Mid-end processes support the advanced manufacturing requirements of 2.5D and 3D TSV as well as wafer-level packaging (WLP), flip chip, and embedded die technology.
"We have had the capability to fabricate, assemble and test TSV interposers for four years and believe the timing is right to invest in 300mm mid-end TSV manufacturing for our customers," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.
Dr. Han continued, "Flip chip and wafer level packaging are important drivers of mid-end processing in addition to the anticipated growth in 3D solutions utilising TSV technology, particularly with the integration of memory and logic devices at advanced technology nodes. The initial markets that are expected to embrace 2.5D and 3D TSV technology are mobile applications and high performance processors for the computing segment. STATS ChipPAC will continue to invest and innovate in TSV technology to offer the next generation of 3D packages to our customers."
STATS ChipPAC was one of the first outsourced semiconductor assembly and test (OSAT) providers to invest in TSV technology with a 51,000 square foot research and development facility dedicated to the development of next-generation wafer-level integration with TSV technology.
TSV uses short vertical interconnections through a silicon wafer to achieve greater space efficiencies and higher interconnect densities than wire bonding and flip chip stacking. When combined with microbump bonding and advanced flip chip technology, TSV technology enables a higher level of functional integration and performance in a smaller form factor.
One of the first implementations of TSV technology is in the form of silicon interposers used to bridge 2D silicon designs into more advanced and efficient 3D configurations. Often referred to as the 2.5D technology, TSV interposers are an immediate and practical approach to die-level integration using the capabilities of TSV technology. TSV interposers provide flexibility for the integration of die from different technology nodes and deliver advantages in miniaturisation, thermal performance and fine line/width spacing in a semiconductor package.
STATS ChipPAC has complete front to back-end manufacturing capabilities for 200mm wafers and currently handles both chip-to-chip and chip-to-wafer assembly for TSV technology. This includes high-density microbump capabilities in solder and copper column materials, microbump bonding down to 40um pitch, thin wafer handling, wafer-level underfill, thin wafer dicing and microbumps for flip chip interconnection. Microbump technology is critical to delivering fine pitch, low profile solutions for high-performance devices.
STATS ChipPAC Ltd. is a service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. Further information is available at www.statschippac.com.