Will PoP delay TSV adoption? TechSearch International analyzes the 3D technologies

May 19, 2011Package-on-package (PoP) provides a cost/performance solution that solves business and logistics issues associated with stacking devices directly. 3D through silicon vias (TSV), with its associated manufacturing and test uncertainties, and questions about who handles what in the supply chain, cannot yet meet PoP’s benefits, says TechSearch International (TSI).

Memory and logic packages can be tested separately before assembly with PoP. Standardization of the top memory package footprint allows memory packages from various suppliers to be interchanged. Memory devices are wire bonded in the top package, but the logic device in the bottom package is migrating to flip chip, including copper pillar.

Package-on-package (PoP) volumes continue to grow with a CAGR of 31% from 2009 to 2015. Applications driving this double-digit growth include mobile phones (especially smartphones), tablets, games, iPods, and digital cameras. "This high growth and broad adoption has been driven by the continuous advancements that PoP has delivered. When Amkor ramped PoP in 2005, the mobile processor clock was 330MHz with a 0.65mm pitch interface to the top SDRAM/NOR combo memory. Now, processor speeds exceed 1 GHz with a 0.4mm pitch interface to the top low power DDR, with near term roadmaps exceeding 2.5 GHz and high-density PoP interfaces supporting two channel LP DDR2. With more than four billion mobile processors forecasted for smart device applications in the next four years, PoP growth and advancements will continue at a high rate," stated Lee Smith, VP of marketing and business development at Amkor Technology.

The latest issue of TechSearch International’s Advanced Packaging Update contains a unit forecast for PBGAs, TBGAs, and CBGAs. Forecasts for FBGAs, QFNs, flex-substrate CSPs, and stacked die CSPs are also provided. Market estimates for each package type are based on input from both captive and merchant assembly operations. Key applications and drivers for unit volume growth are highlighted. The report also includes an analysis of the impact of the tragic events in Japan on the electronics industry infrastructure. A special section provides insights into packages for automotive electronics. Included in the Update Service is a complimentary set of PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research firm specializing in technology trends in microelectronics packaging and assembly. For more information, visit http://www.techsearchinc.com

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