AMAT RTP heats wafer backside for better temp uniformity

June 29, 2011 — Applied Materials Inc. (AMAT) launched the Applied Vantage Vulcan rapid thermal processing (RTP) system for wafer annealing. The AMAT tool improves wafer uniformity by way of backside heating, even for 20nm transistors. The Vantage Vulcan joins AMAT’s Vantage line of RTP tools for wafer processing.

Applied Materials designed the Vantage Vulcan to eliminate hot spots on wafers caused by direct radiant heating. The RTP tool applies heat entirely to the unpatterned backside of the wafer and uses AMAT’s honeycomb lamp array, acheiving within-die temperature uniformity to less than

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...