Inside Leti: FDSOI, 3D packaging, Si photonics work

August 12, 2011 — Laurent Malier, CEO of Leti, described the research group’s work and the outlook on fully depleted silicon on insulator (FDSOI), 3D packaging technologies, and integrated photonics on silicon (Si photonics), in a video interview at SEMICON West 2011.


Malier says performance data at 22nm shows FDSOI is comparable to FinFET with respect to the speed gain and low power performance. FDSOI technology is also easily manufactured and it’s ready for scale down to 11nm, Malier notes.

Leti also recently demonstrated 3

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