Epson inkjet semiconductor marking system prevents die damage

September 27, 2011 — Seiko Epson Corporation (TSE:6724) introduced the IP-2000 inkjet semiconductor marking system to print identification data, such as the manufacturer’s name or a production number, on the surface of a semiconductor package.

The system prints faster and more clearly than laser engraving, protecting the chip inside the semiconductor package from damage. Semiconductor packages are "smaller and thinner," said Hideo Hirao, responsible for Epson’s Factory Automation Division, and require protection from die breakage and chipping, and cuts from lasers engraving too deeply. Since the system does not need printing plates, it can be used for small-lot production.

The IP-2000 cleans the package surface, then uses Epson’s proprietary Micro Piezo technology to apply high-visibility white ultraviolet (UV)-cured ink, also developed by Epson. Ultraviolet irradiation is undertaken simultaneously with printing to solidify the ink.

Epson is a global imaging company offering printers and 3LCD projectors for business and the home, to electronic and crystal devices. The Epson Group is led by the Japan-based Seiko Epson Corporation. Learn more at

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