IRphotonics installs thermal camera for IR cure R&D

September 14, 2011 — Infrared materials and systems supplier IRphotonics added a high-resolution FLIR thermal imaging camera to its application engineering lab. The camera will be used to analyze heat distribution during iCure use.

IRphotonics engineers hope to optimize energy, wavelength and irradiance for particular processes, developing customized curing profiles with better control and manufacturing productivity, said Ruben Burga, VP of sales for IRphotonics.

The iCure AS200 inline fiber optic spot cure system uses infrared radiation to heat-cure thermal epoxies, bond plastic and glass components such as lenses, affix miniature components, assemble and bond semiconductor components, microsolder, and perform other precise welding operations. The system suits use with temperature-sensitive substrates and complex devices.

IRphotonics will be demonstrating the iCure AS200 at booth 765 at the MD&M Midwest in Chicago, September 20-23, 2011.

IRphotonics designs and manufactures infrared fibers and systems for the transmission of infrared light, and for assembly operations requiring high intensity infrared heat. For more information, visit www.icure-irphotonics.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...