Multi-die face-down packaging suits existing wire bond lines

September 8, 2011 – BUSINESS WIRE — Invensas Corporation, a Tessera Technologies Inc. (Nasdaq:TSRA) wholly owned subsidiary, will demonstrate dual-face down (DFD) implementation of its new multi-die face-down (xFD) semiconductor packaging technology at the Intel Developer’s Forum this month.

The multi-die package is wire bonded, mounting ICs upside down and staggering them in a shingle-like configuration. The short wire bonds required resemble those of a window-BGA package. The design creates 25-35% vertical form factor savings from conventional packages. Speed-bin yield increases 50-70% thanks to the symmetric top and bottom die performance. Thermal management is improved with 20-30% better heat dissipation than conventional dual-die packages (DDPs), according to the company.

Invensas XFD is a "market-ready" packaging technology that can be performed on existing wire-bond lines. A parallel process packaging flow reduces manufacturing costs for the multi-die DRAM packages, specifically reducing materials usage, including gold.

The packages improve DRAM/memory capacity and performance, targeting data center servers, tablets/smartphones, and other applications. Simon McElrea, president of Invensas Corporation, touts "single-die package performance in a multi-die configuration" with density and cost advantages.

Invensas will demonstrate its DFD technology at the Intel Developers Conference in San Francisco’s Moscone Center, West Hall, Booth #414, September 13-15, 2011.

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), acquires, develops and monetizes strategic intellectual property (IP) in areas such as circuitry design, 3D systems, memory modules and other enabling technologies. Go to

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