Ziptronix low-temp direct oxide bonding scales pixels to 0.7

September 27, 2011 — Ziptronix announced just before SEMICON Taiwan that its low-temperature direct oxide bonding technology — Zibond, used for constructing backside-illuminated (BSI) structures in image sensors — was licensed by Sony. In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the wafer bonding technology and what the Sony deal means in the podcast below.


 

Because adhesives do not have high bonding energy at low temperatures, the result is high distortion, therefore, these materials are not usable for scaling smaller pixel sizes, said Enquist. Conversely, the company

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...