EVG launches ZoneBond-capable modules

EV Group (EVG) launched a suite of temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND technology.  ZoneBOND defines two distinctive zones on the carrier wafer surface with strong adhesion in the perimeter (edge zone) and minimal adhesion in the center zone.  As a result, low separation force is only required for carrier separation once the polymeric edge adhesive has been removed by solvent dissolution or other means.

EVG is also pursuing an

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