Lasers package ultrathin semiconductors at low cost, high volume

October 26, 2011 — North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.

Laser-Enabled Advanced Packaging (LEAP) can be scaled to high volumes, and is a contactless assembly method for ultrathin semiconductor chips onto rigid and flexible substrates. NDSU researchers have successfully implemented LEAP to fabricate a functional electronic device on a flexible substrate.

Figure 1. Microelectronics packaging developed at North Dakota State University, Fargo. Laser-Enabled Advanced Packaging (LEAP) uses Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT).

The technology has been under development by the Advanced Electronics Packaging research group at the North Dakota State University Center for Nanoscale Science and Engineering (CNSE), Fargo, N. D., since 2008. The research group is led by Dr. Val Marinov, associate professor of manufacturing engineering; and includes Dr. Orven Swenson, associate professor of physics at NDSU; Ross Miller, research engineer apprentice; and CNSE research staff, graduate students and undergraduate research assistants.

The laser-assisted packaging process selectively and rapidly places ultra-thin (<50

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