Microsemi taps Amkor for SoC package test

November 14, 2011 — Microsemi SoC Products Group will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products.

Tester platforms at Amkor will be configured to the same set up as Microsemi SoC Products Group, to avoid any change to form, fit, function, test coverage, or quality of the product. Amkor

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