STATS ChipPAC expands wafer-level chipscale packaging in Taiwan

November 17, 2011 – Marketwire — STATS ChipPAC Ltd. (SGX-ST:STATSChP), semiconductor test and advanced packaging service provider, completed the expansion of its 300mm wafer bump and wafer-level chipscale packaging (WLCSP) operation in Taiwan.

STATS ChipPAC invested more than $150 million in Taiwan, building up a full turnkey wafer bump and WLCSP offering. The expansion increased production capacity at STATS ChipPAC Taiwan Co. Ltd. to 420,000 bumped wafers/year and 60,000 WLCSP devices/year. STATS ChipPAC Taiwan’s advanced WLP technologies include low-temp cure polymers, copper for under bump metallization (UBM) and redistribution layers (RDL), and more.

In January 2011, STATS ChipPAC grew its 300mm wafer-level packaging ops at the site.

Wafer-level, flip chip, and wafer bump packaging processes "cater to the most demanding needs of mobile and consumer devices," said Wan Choong Hoe, EVP and COO, STATS ChipPAC. STATS ChipPAC is growing this business to support advanced technology nodes and form factors. Benefits of WLCSP include virtually die-sized packages, better thermal performance, finer pitch board-level interconnects, and improved functionality.

"We have tripled our Class 100 cleanroom space to 3,478 square meters or 37,437 square feet and significantly increased both our 300mm bump and WLCSP capacity. We have been working to expand our technology processes to support bump pitches down to 40um," said Richard Weng, managing director, STATS ChipPAC Taiwan.

An official inauguration was held at STATS ChipPAC Taiwan with more than 80 honoured guests and company management participating.

STATS ChipPAC Ltd. performs semiconductor packaging design, assembly, test and distribution. STATS ChipPAC is listed on the SGX-ST. Further information is available at

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