SUSS MicroTec sends equipment to SVTC in MEMS, 3D IC dev partnership

November 15, 2011 — Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging (WLP) for micro electro mechanical systems (MEMS) and 3D IC bonding.

The companies will focus on developing "new processes and solutions in the field of wafer-level packaging," said Frank P. Averdung, president and CEO, SUSS MicroTec AG, noting SVTC’s complementary skill set in research and innovation. The companies will jointly develop and characterize new lithography and wafer-bonding technologies.

SUSS MicroTec consigned alignment and bonding equipment to one of SVTC


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