TowerJazz brings European partner to India and Brazil

November 17, 2011 – Business Wire — Specialty foundry TowerJazz signed a non-exclusive memorandum of understanding (MOU) with a European entity to transfer processes and projects to India and Brazil.

TowerJazz will supply training, manufacturing expertise, project management, and technical support. The European partner will supply intellectual property (IP) licenses, supporting services, and training.

TowerJazz and its European partner share over 15 years of collaboration in various process transfer activities and transactions. The companies can collaborate on technology nodes from 1µm to 32nm, including micro electro mechanical systems (MEMS).

This partnership will target Indian and Brazilian fabless companies, and IDMs with Indian and Brazilian end markets. Growth potential in India and Brazil’s semiconductor industries is high, TowerJazz asserts. TowerJazz joined efforts with a nanoelectronics research leader to collaborate in technology transfer to these regions. The structure for project transfers to growing markets comes from TowerJazz’s TOPS business unit.

Tower Semiconductor Ltd. (TSEM), its fully owned U.S. subsidiary Jazz Semiconductor Ltd., and its fully owned Japanese subsidiary TowerJazz Japan, Ltd., operate collectively under the brand name TowerJazz, the global specialty foundry leader. For more information, please visit www.towerjazz.com.

Subscribe to our MEMS Direct newsletter

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...