ST eliminates wafer probes for on-wafer die test

Secember 14, 2011 — STMicroelectronics (NYSE:STM) produced a semiconductor wafer tested via electromagnetic waves rather than physical wafer probes.

ElectroMagnetic Wafer Sort (EMWS) was developed from Electrical Wafer Sort (EWS), performed at the end of wafer processing and before package assembly and final test. In EMWS, each die contains a tiny antenna. Automated test equipment (ATE) supplies power and communicates with the die via electromagnetic waves.

The ATE uses probes only to power-up the wafer in high-power products. Low-power products are tested with no contact at all.

EMWS is the result of UHF TAG Antenna Magnetically Coupled to Integrated Circuit (UTAMCIC), an R&D initiative led by Alberto Pagani, Giovanni Girlando and Alessandro Finocchiaro from STMicroelectronics and Professor Giuseppe Palmisano from the University of Catania.

The die, such as RFID ICs, can be tested with higher yields, shorter testing times, and lower product cost, under close-to-real-operation conditions, ST asserts. Die size can be reduced with fewer test pads required.

The biggest benefit will go to customers using ST’s low-power RF circuits, said Alberto Pagani, Test R&D and Competitive Intelligence, ST. "Because the RF circuits, anticollision protocol, and embedded antenna are tested under the same conditions they will operate under in the customer

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...