SUSS Microtec launches high-volume temporary wafer bonder with 1st install

December 5, 2011 — SUSS MicroTec, equipment supplier for the semiconductor and related markets, launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling.

Key process steps include adhesive and release layer deposition, temporary bonding and curing and integrated metrology to determine the total thickness variation (TTV). Features include higher throughput and sophisticated process control, according to SUSS MicroTec.

Process configurations can be designed for very-low-force bonds such as the Thin Materials (TMAT) process or the 3M Wafer Support System (WSS), and higher-force thermo-compression bonds as used in the BrewerScience ZoneBOND process. SUSS today announced that ZoneBOND can be performed on its XBC300 wafer bonding platform as well.

The system supports all currently-available temporary bonding adhesives. Additionally, several materials manufacturers are developing new temporary bonding adhesives that are fully compatible with SUSS’ XBS300 equipment platform.

The XBS300 is based on SUSS’s ACS300 Gen2 cluster platform.

The first tool has been delivered to a world-leading IDM with the installation currently in progress.

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, provides equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.

Also read: Temporary wafer bonding market: More than 10 approaches today and Thin wafers win majority in electronics by 2016

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