SUSS Microtech adds Brewer Science ZoneBond to wafer bonders

December 5, 2011 — Brewer Science Inc., materials and processes developer for thin wafer handling, will offer the ZoneBOND process on equipment supplier SUSS MicroTec’s XBC300 and XBS300 wafer bonding platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers.

ZoneBOND is designed for total thickness variation control in wafer bonding processes, high-temperature stability, and low-stress wafer de-bonding. Brewer Science supports the ZoneBOND process with materials for carrier preparation, adhesives, removers, as well as small-scale debonding equipment.

Shortly after the ZoneBOND technology was commercialized, equipment supplier EV Group (EVG) launched ZoneBond-capable modules.

Brewer Science makes specialty materials, equipment, and process solutions for applications in semiconductors, advanced packaging/3-D ICs, MEMS, sensors, displays, LEDs, and printed electronics. For more information, please visit http://www.brewerscience.com/products/temporary-bonding-materials/zonebond

SUSS MicroTec (listed on TecDAX of Deutsche Boerse AG) provides equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit www.suss.com.

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