Camtek launches TEM for advanced semiconductor makers

January 9, 2012 — Camtek Ltd. (NASDAQ and TASE: CAMT) launched Xact200, its second generation transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to traditional focused ion beam (FIB) analysis.

Camtek has received its first purchase order for the tool, from a leading semiconductor company in Asia.

TEM enables analysis of small semiconductor feature dimensions and complex materials. The Xact200 enables sample preparation for 2X and 1X nodes, combining Adaptive Ion Milling (AIM) technology with an integrated FE SEM column and in-process STEM imaging capability. AIM can reduce lamella thickness <20nm over a large area with high precision, artifact-free quality, and higher throughput, Camtek reports.

Camtek Ltd. provides intelligent imaging, image processing, adaptive ion milling (AIM) and digital material deposition (DMD) for semiconductor and PCB and IC substrate production. Website:

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