Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

January 18, 2011 — Die bonder supplier Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging, February 7-8, 2012 in San Diego, CA.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. For a full program at the event, visit http://www.imaps.org/rf/index.htm.

RF and microwave device interconnection requires wedge bonding with ribbon wire, due to its ability to create flat, extremely low loop shape, and constant wire length. For high-frequency electrical signals, conduction occurs in the skin, or outer 0.5

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