Cypress Semiconductor unveils single-layer touchscreen sensor ITO

February 28, 2012 — Cypress Semiconductor Corp. (NASDAQ:CY) released a single-layer touchscreen sensor with multitouch capability, the SLIM (Single-Layer Independent Multitouch) sensor. SLIM is a single-substrate, single-layer indium tin oxide (ITO) touchscreen sensor with no additional insulation layers or bridges. It can be deposited directly on the display’s cover glass.

The product targets low-cost, high-accuracy touchscreen phones — including feature phones — with pinch, zoom, flick, drag, and other gesture recognition in capacitive touchscreens. It costs reportedly 40% less than other multi-touch sensors, with a thinner sensor module.

The SLIM sensor pattern can eliminate the requirement for a 2mm side bezel on each side of the end product. Borderless diplay modules using the SLIM touch sensor can use larger displays without changing the phone form factor.

The SLIM sensor is available with Cypress’ Gen4 controllers, among others, with noise immunity for sensor-on-lens configurations that are directly laminated to the display with no shielding or air gaps. Cypress has developed proprietary algorithms that interface with the single-layer sensor. Cypress’s TrueTouch technology also has high signal to noise ratio (SNR), fast refresh rates, low power consumption, and high accuracy and linearity.

Cypress delivers high-performance, mixed-signal, programmable electronics products. Cypress trades on the NASDAQ Global Select Market under the ticker symbol CY. Visit Cypress online at

Visit the new Displays Manufacturing Channel on!


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...