SUSS wafer bonder/debonder features up to 6 modules in new generation

February 6, 2012 — Semiconductor process equipment maker SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.

The Gen2 tool doubles the number of process modules available over the first generation of XBC300. It can be configured for any major permanent bonding process, as well as mechanical debonding processes at room temperature. Cleaning processes for 3D integration and 3D packaging are also supported. Cu-Cu, polymer, fusion and hybrid bonding processes can take place in the tool.

When configured as a debonder and cleaner the XBC300 Gen2 is the complementary platform to SUSS MicroTec’s XBS300 temporary wafer bonder. Device wafers are temporarily bonded to a carrier in the XBS300 and are debonded at room-temperature and cleaned on the XBC300 Gen2 after passing all the backside processing steps. The XBC300 Gen2 debonder/cleaner is configured for handling carrier wafers or film frames.

Also read: SUSS Microtech adds Brewer Science ZoneBond to wafer bonders

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, provides equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit

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