Tokyo Electron joins Luxtera investors in $21.7M Round C

February 27, 2012 — Silicon CMOS photonics company Luxtera closed $21.7 million in Round C financing, with participation from NEA, August Capital, Sevin Rosen, Funds, and Lux Capital, as well as new investor Tokyo Electron (TEL), and personal investment from an industry titan.

Luxtera is adding Martin Colombatto, with executive experience at Staccato Communications and Broadcom, to its board of directors. Colombatto most recently served as the CEO and president of Staccato Communications, an Ultra Wide Band (UWB)/ wireless USB company. He served as VP and GM of Broadcom’s Networking Business Unit, where he established and managed a business that generated more than $400 million in revenue over four years. As a corporate officer and member of the executive staff, he led the acquisition of five companies that were integrated into his business and formed the technology and product foundation for future revenue growth.

Colombatto called for a "defining industry transition" from copper interconnect to silicon CMOS photonics, while Greg Young, president and CEO of Luxtera, noted that silicon CMOS photonics is moving from "the exotic research labs of Intel and IBM" to mainstream electronics.

Luxtera Inc. is a fabless semiconductor company integrating high-performance optics directly with silicon electronics on a mainstream CMOS chip. Web site: www.luxtera.com.

View recent issues of the MEMS Direct newsletter

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...